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bonding-temperatures
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A study on the effects bonding temperature and holding time on mechanical and metallurgical properties of al–cu dissimilar joining by DFW
, Article Transactions of the Indian Institute of Metals ; Volume 70, Issue 1 , 2017 , Pages 125-131 ; 09722815 (ISSN) ; Paidar, M ; Youzbashi zade, H ; Sharif University of Technology
Springer India
2017
Abstract
The aim of this study was to evaluate the influence of bonding temperature and holding time on the metallurgical and mechanical properties for weld joints of 5 mm aluminum to copper using Sn interlayer. The bonding temperature varied from 500 to 600 °C whilst the holding time varied from 30 to 120 min under 8 MPa uniaxial load in 1 × 10−4 torr vacuum. The microstructure analysis, phase analysis and distribution of elements in the interface were performed by scanning electron microscopy, energy-dispersive X-ray spectroscopy, and element map analysis. It was found that diffusion welding parameters had a significant effect on shear strength. The attained data of tensile strength tests showed...
Microstructural evolution in the transient-liquid-phase bonding area of IN-738LC/BNi-3/IN-738LC
, Article Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science ; Volume 39, Issue 10 , 2008 , Pages 2389-2402 ; 10735623 (ISSN) ; Ekrami, A ; Ohsasa, K ; Matsuura, K ; Sharif University of Technology
2008
Abstract
Transient-liquid-phase (TLP) bonding of the IN-738LC base alloy with BNi-3 interlayer was investigated in this article. Effects of the TLP bonding thermal cycle on the base alloy were studied microstructurally and macrostructurally. Microscopic investigation revealed that the microstructural evolution in the TLP bonding area was affected substantially by the bonding temperature. Therefore, a critical bonding temperature (Tcr) was defined for TLP bonding of IN-738LC/ BNi-3/IN-738LC samples. Unlike bonding below Tcr, TLP bonding at temperatures higher than Tcr resulted in formation of individual γ-γ' colonies in the adjacent base alloy to TLP bonding zone and caused significant reduction in...
An Investigation on the Diffusion Welding of Aluminum to Copper Using ECAE Process
, M.Sc. Thesis Sharif University of Technology ; Karimi Taheri, Ali (Supervisor)
Abstract
A new method for production of bimetallic rods, utilizing the equal channel angular extrusion (ECAE) process has been introduced before by previous researchers, but no attempt has been made to assess the effect of different temperatures and holding times in order to achieve a diffusional bond between the mating surfaces. In present research copper sheathed aluminum rods have been ECAEed at room temperature and subsequently held at a constant ECAE pressure, at different temperatures and holding times to produce a diffusional bond between the copper sheath and the aluminum core. The bonding quality of the joints was examined by shear strength test. The microstructure examinations were carried...
An investigation on diffusion bonding of aluminum to copper using equal channel angular extrusion process
, Article Materials Letters ; Volume 65, Issue 12 , June , 2011 , Pages 1862-1864 ; 0167577X (ISSN) ; Taheri, A. K ; Sharif University of Technology
2011
Abstract
A new method for production of bimetallic rods, utilizing the equal channel angular extrusion (ECAE) process has been introduced before by previous researchers, but no attempt has been made to assess the effect of different temperatures and holding times in order to achieve a diffusional bond between the mating surfaces. In present research copper sheathed aluminum rods have been ECAEed at room temperature and subsequently held at a constant ECAE pressure, at different temperatures and holding times to produce a diffusional bond between the copper sheath and the aluminum core. The bonding quality of the joints was examined by shear strength test and a sound bonding interface was achieved....
The effect of TLP bonding temperature on microstructural and mechanical property of joints made using FSX-414 superalloy
, Article Materials Science and Engineering A ; Volume 546 , June , 2012 , Pages 291-300 ; 09215093 (ISSN) ; Ekrami, A ; Khan, T. I ; Sharif University of Technology
2012
Abstract
The bonding temperature is an important parameter for optimization of the Transient Liquid Phase (TLP) bonding process in order to achieve a sound joint with good mechanical properties. However, the bonding temperature used can also be restricted by the microstructural stability of the base metal. In this study, the effect of bonding temperature (1050-1200 °C) on the joint microstructure and mechanical properties was studied for TLP bonding of FSX-414 superalloy using MBF-80 interlayer with thickness of 50 μm. Increasing bonding temperature from 1050 to 1150 °C caused reduction in the time required for complete isothermal solidification in agreement with models based on the diffusion induced...
Effect of bonding temperature on microstructure development during TLP bonding of a nickel base superalloy
, Article Journal of Alloys and Compounds ; Volume 469, Issue 1-2 , 2009 , Pages 270-275 ; 09258388 (ISSN) ; Ekrami, A ; Kokabi, A. H ; Sharif University of Technology
2009
Abstract
The effect of bonding temperature on microstructure of a transient liquid phase (TLP)-bonded GTD-111 nickel base superalloy, using a Ni-Si-B interlayer, was investigated. At low bonding temperatures microstructure of the joint centerline is controlled by B diffusion. However, at high bonding temperature effect of base metal alloying elements on the joint microstructure development was more pronounced. Effects of bonding temperature on the formation of secondary precipitates in diffusion-affected zone and isothermal solidification time were also analyzed. It was found that above a critical temperature, formation of borides in diffusion-affected zone is suppressed and the time required for...