Sharif Digital Repository

High integration and increased elements density in 3D Network on Chip (NoC) will cause more energy consumption and high temperature on chip. By mapping those tasks that have data communication between them to near cores, the communication delay and therefore, power consumption will be reduced. In addition, mapping the tasks to cores that are near the heat sink, in such a way that the generated heat is distributed indiscriminately all over the chip, will decrease maximum chip temperature. In this paper, we propose a task mapping method based on fuzzy logic that aims to alleviate power and thermal problems in 3D-NoCs. In this method, the weight of task mapping factors can be changed according... 

Temperature gradient on the thick Reactor Pressure Vessel (RPV), caused by sudden overcooling events, especially in the downcomer, would intensify the propagation of structural defects. This situation known as Pressurized Thermal Shock (PTS) could be created in case of Emergency Core Cooling System (ECCS) actuation which leads to injection of cold water into the cold leg of the primary loop in some accidents, e.g. Loss Of Coolant Accident (LOCA). Prediction of Plant response to LOCA and water temperature gradient in the downcomer are performed in thermal-hydraulic section of PTS analysis. Employment of system codes is one of the proposed procedures in literature to obtain plant response and...