Sharif Digital Repository

The widespread application of deep sub-micron and multilayer routing techniques makes the interconnection parasitic influence become the main factor to limit the performance of VLSI circuits. Therefore, fast and accurate 3D capacitance extraction is essential for ultra deep sub-micron design (UDSM) of integrated circuits. Parallel processing provides an approach to reducing the simulation turn-around time. In this paper, we present parallel formulations for 3D capacitance extraction based on P-FFT algorithm, on a personal computer (PC) or on a network of PCs. We implement both vector and parallel versions of 3D capacitance extraction algorithm simultaneously and evaluate our implementation... 

Increasing delay and power variation has become a major challenge to designing high performance Multiprocessor System-On-Chips (MPSoC) in deep sub-micron technologies. As a result, a paradigm shift from deterministic to statistical design methodology at all levels of the design hierarchy is inevitable. In this paper, we propose a static variation-aware task scheduling and power mode selection algorithm for MPSoCs. The proposed algorithm is able to maximize the total power yield of the chip under a given performance yield constraint by searching for the optimal task scheduling and power mode selection policy for a specified multiprocessor platform. Experimental results are gathered by... 

Use of deep sub-micron VLSI technologies in fabrication of Network on Chips (NoCs) makes the reliability to be one of the first order concerns in the design of these products. This paper proposes and evaluates a methodology that adds reliability to NoC routing algorithms with minimal power and performance overheads. The key idea behind this methodology is to use the concept of complement routing in which two routing algorithms with disjoint sets of allowed turns are incorporated. According to this methodology, while a packet is routed by a routing algorithm, a redundant copy of that packet is routed by the complement of that routing algorithm. This is done by exploiting channels with lower... 

Delay and leakage power uncertainty caused by process variation has become a challenging problem in deep submicron technologies. In recent years, the designers have developed methods to tackle this problem in many design levels such as high level synthesis and system level synthesis. This paper addresses the problem of variation-aware task scheduling and binding for multiprocessor system-on-chip (MPSoC). We consider both delay and leakage power variations during the process of finding the best schedule so that leakier processors are less utilized and can be more frequently put in sleep mode to reduce power. Our algorithm takes advantage of event tables to accelerate the statistical timing... 

Coupling capacitances between adjacent wires in on-chip interconnects significantly affect the amount of power consumption in Ultra-Deep-Submicron technologies. On the other hand, the propagation delay across global on chip interconnects has increasingly become a limiting factor in high-speed design. Crosstalk between adjacent links on the bus contributes a significant portion of this delay. Crosstalk noise also affects the integrity of signals. Decreasing the coupling transitions can improve the side effects of crosstalk noise. We propose an algorithm to minimize the coupling activity transition. We also introduce a new solution to fit the proposed algorithm for Network-on-Chip (NoC)... 

Reliability is one of the main concerns in the design of network on chips due to the use of deep-sub micron technologies in fabrication of such products. This paper proposes a fault-tolerant routing algorithm called XYX which is based on sending redundant packets through the paths with lower traffic loads. The XYX routing algorithm makes a redundant copy of each packet at the source node and exploits two different routing algorithms to route the original and the redundant packets. Since two copies of each packet reach the destination node, the erroneous packet is detected and replaced with the correct one. Due to the use of paths with lower traffic rates for sending redundant packets and... 

Single event upsets (SEUs) and single event transients (SETs) are major reliability concerns in deep submicron technologies. As technology feature size shrinks, digital circuits are becoming more susceptible to SEUs and SETs. A novel SEU/SET-tolerant latch called feedback redundant SEU/SET-tolerant latch (FERST) is presented, where redundant feedback lines are used to mask SEUs and delay elements are used to filter SETs. Detailed SPICE simulations have been done to evaluate the proposed design and compare it with previous latch designs. The results show that the SEU tolerance of the FERST latch is almost equal to that of a TMR latch (a widely used latch which is the most reliable among the... 

In this paper, the systematic error due to interpolation in CMOS deep sub micron folding and interpolating ADC is studied and a closed form equation is presented to calculate the error as a function of interpolation coefficient, input voltage range and the number of input differential pairs. The amount of INL due to interpolation error can be considered as the lower bound for attainable INL of a specific ADC architecture. A case study for an 8_bit ADC is treated under consideration of different folding and interpolating factors. The trade off between power dissipation and ADC performance is characterized according to input stage characteristics. ©2006 IEEE