Sharif Digital Repository

The out-of-pack cementation method was applied to coat the Nickel-based super alloy IN738LC with Si-modified aluminide. Different mixtures of the pack containing pure Al, Si, alumina powders as an inert filler, and NH4Cl as a halide salt activator were used for co-deposition at 950 and 1,050°C. The results showed although the amount of subhalide vapour pressures of Al and Si were equal at 1,050°C, Al atoms diffused only after Si atoms had been deposited. Before heat treatment, the coating thickness formed by the pack containing 2.3 wt.% Al was 6 μm more than that containing 3.5 wt.% Al. After heat treatment, thickening coatings formed within the pack containing 2.3 wt.% Al was less than that... 

In this study, tungsten oxide films were synthesized by pulsed laser deposition (PLD) method. The as-deposited films were annealed at a temperature of 250 and 350°C in air for 1 h. The surface morphology, microstructure, crystalline phase and chemical composition of the as-prepared and annealed films were characterized by SEM, XRD and XPS techniques, respectively. Deposition of Pd nanoparticles onto the tungsten oxide surface was performed by hydrogen reduction of a drop-drying PdCl 2 solution onto a WO 3 surface at 60°C. The influence of the annealing temperature on microstructure and gasochromic performance as well as the effect of operating temperature is presented in this work. Results... 

In this study the effect of deposition temperature and thickness on the physical properties of carbon films deposited by magnetron sputtering PVD was investigated. The results of Raman spectra and grazing incidence XRD (GIXRD) patterns show that the graphitization increases by increasing the deposition temperature. There is a change in deposition mechanism at 400 °C from amorphous carbon deposition to nano-structured graphite deposition. Also by increasing substrate temperature the electrical resistance of carbon films reduces significantly up to 300 °C and then remains largely constant. High intrinsic compressive stress in low temperature deposited carbon films causes cracks and...