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distributed-activation-energy-model--daem
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Kinetic Investigation of the Thermal Treatment of E-Waste with Particular Emphasis on Printed Circuit Boards (PCBs)
, M.Sc. Thesis Sharif University of Technology ; Fotovat, Farzam (Supervisor)
Abstract
In this study, pyrolysis features and corresponding kinetic behavior of non-metallic fractions of the paper-laminated phenol resin printed circuit boards (P-PCB) and fiberglass-reinforced epoxy resin printed circuit boards (E-PCB) were investigated by the use of simultaneous thermogravimetric analysis (TGA/DTG). The kinetic parameters of the P-PCB abs E-PCB during pyrolysis process were estimated from the experimental data by means of three iso-conversional kinetic models, including Friedman, Flynn-Wall-Ozawa (FWO), and Kissinger-Akahira-Sunose (KAS) methods. The activation energy range obtained for P-PCB and E-PCB utilizing the Friedman method was within 117–594.1 and 88.42-295.3 kJ.mol-1,...