Sharif Digital Repository

Combining the concept of Network-on-Chip (NoC) with three dimensional integrated circuits technology on 3D NoC enables reduction of propagation delay, interconnect power consumption, and die area, as well as increase in system operational bandwidth. Nevertheless, reducing the feature size of semiconductor technologies has raised certain aging mechanisms, like Negative Bias Temperature Instability (NBTI) and Electromigration, as the main reasons for reduction in reliability and lifetime of NoCs. Reduction in die area results in an increase in power density of the chip, which exacerbates temperature-related concerns of 3D NoCs compared to 2D NoCs. Thus, the aging mechanisms that are directly... 

In recent years, organo-metal perovskite solar cells have attracted remarkable attention due to their low cost manufacturing method as well as the rapid growth of efficiency. Despite the fast growing efficiency of organo-metal perovskite solar cells, there are big challenges around their low stability under real operational condition. In addition to extrinsic parameters like oxygen and humidity, intrinsic instability of perovskite rises mainly from ion migration in perovskite film. In order to understand the ion migration and its effect on photovoltaic parameters of the devices, appropriate characterizations and analysis are needed. Since ions are much slower compare to electrons, their... 

Estimating the life-time of electronic devices has always been an important issue in their mass production. Nowadays, electronic chips are widely used due to technological advances and due to their smaller size. They may be more likely to break down because of their complexity. Therefore, estimating their life-time has received much attention. In the first chapters of this thesis, the concepts and standards that exist in the field of reliability and the life expectancy of electronic devices are discussed. There are many reasons for chip failure, which are beyond the scope of this thesis but what is known as the most important cause of failure which is named electromigration has been...