Sharif Digital Repository

This paper describes a systematic approach to characterize flip-chip solder bump interconnects to accurately design mm-wave on-chip devices and matching circuits for on-package components. Variety of on-chip test structures are fabricated and measured from DC to 67 GHz by GSG probes landed on bare and bumped pads. Combination of two double-delay based de-embeding methods are used to calculate the transmission lines (TLs) and interconnect characteristics. Furthermore, scattering parameter of bare pads and bump pads are accurately extracted from measurement results without lumped element assumption  

The authors address the use of sparse representation to securely hide a message within non-overlapping blocks of a given colour image in the wavelet domain. All four sub-images of the two-dimensional wavelet transform of two colour bands are used for data embedding without affecting the image perceptibility. Bit error rate of hidden data extraction is reduced to zero by introducing a novel refinement procedure in the proposed algorithm. The refinement procedure introduced solves the hidden bit extraction errors caused by the rounding process, the overflows and the nature of approximation in sparse decomposition. Capacity of the proposed method is calculated using necessary conditions for... 

In both public and private sectors, critical technology-based tasks, such as innovation, forecasting, and road-mapping, are faced with unmanageable complexity due to the ever-expanding web of technologies which can range into thousands. This context cannot be easily handled manually or with efficient speed. However, more precise and insightful answers are expected. These answers are the fundamental challenge addressed by tech-mining. For tech-mining, discovering the associations among them is a critical task. These associations are used to form a weighted directed graph of technologies called “association tech-graph” which is used for technology development, trend analysis, policymaking,...