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high-molecular-weight-polyethylenes
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Thermal degradation behavior and kinetic analysis of ultra high molecular weight polyethylene based multi-walled carbon nanotube nanocomposites prepared via in-situ polymerization
, Article Journal of Macromolecular Science, Part A: Pure and Applied Chemistry ; Volume 49, Issue 9 , 2012 , Pages 749-757 ; 10601325 (ISSN) ; Saadatabadi, A. R ; Khorasheh, F ; Sharif University of Technology
T&F
2012
Abstract
Thermal degradation behavior of multi-wall carbon nanotubes (MWCNTs)/ultra high molecular weight polyethylene (UHMWPE) nanocomposites, with different nanotubes contents (0.5, 1.5 and 3.5 wt%) prepared via in-situ polymerization technique have been investigated using thermal gravimetric analysis (TGA). TGA spectra revealed that these nanocomposites had enhanced thermal stability and no significant mass loss (<0.4 wt%) occurred up to 350°C. Thermal degradation of these UHMWPE/MWCNT nanocomposites was investigated in terms of parameters such as the onset temperature of degradation (T 10), the decomposition temperature at 50% wt loss (T 50), the degradation temperature of maximum rate of the...
High performance Dyneema® fiber laminate for impact resistance/macro structural composites
, Article Journal of Thermoplastic Composite Materials ; Volume 25, Issue 4 , 2012 , Pages 403-414 ; 08927057 (ISSN) ; Yazdanirad, M ; Mirhabibi, A ; Sharif University of Technology
2012
Abstract
UHMWPE composite materials are increasingly used in armors design due to their high strength-to-weight ratios and energy absorption capacities. In this study the effect of production parameters upon the terminal ballistic properties of UHMWPE composite were examined under different conditionings. The composite armor plate laminates were produced by hot pressing with three different pressing times from 10-30 minutes and the laminates conditioned at +115, +125, and +135°C. The molding temperature of SK66 fiber composite has the main direct effect on the ballistic absorption energy, so the relation of molding temperature with the adhesive bonding force between layers, the thickness of the...