Sharif Digital Repository

Nowadays networks-on-chip are emerging as a hot topic in IC designs with high integration. Much research has been done in this field of study recently, e.g. in routing algorithms, switching methods, VLSI Layout, and effects of resource allocation on system performance. On the other hand, three-dimensional integrated circuits allow a time-warp for Moore's Law. By vertically stacking two or more silicon wafers, connected with a high-density, high-speed interconnect, it is now possible to combine multiple active device layers within a single IC. In this paper, we examine performance and power consumption in a three dimensional network-on-chip structure under different types of traffic loads,...