Sharif Digital Repository

In this paper, n-tier methodology is developed to design multilevel interconnect architecture of macrocells using single-wall carbon nanotube (SWCNT) bundles. Upper limit of low-bias voltage of SWCNT bundle interconnects is derived and its dependence on temperature, SWCNTs' diameter, and interconnect length is studied. Possibility of using SWCNT bundles as local interconnects at 7.5-nm technology node is discussed, and it is shown that SWCNT bundles with 1 nm diameter cannot be used at the first interconnect metal level. Using Cu and SWCNT bundles, multilevel interconnect architecture of a 7.5-nm ASIC macrocell is designed which reduces the number of metal levels by 27% and power dissipation... 

In this paper, we propose a new architecture for nanophotonic Networks on Chip (NoC), named 2D-HERT, which consists of optical data and control planes. The proposed data plane is built upon a new topology and all-optical switches that passively route optical data streams based on their wavelengths. Utilizing wavelength routing method, the proposed deterministic routing algorithm, and Wavelength Division Multiplexing (WDM) technique, the proposed data plane eliminates the need for optical resource reservation at the intermediate nodes. For resolving end-point contention, we propose an all-optical request-grant arbitration architecture which reduces optical losses compared to the alternative... 

Network on chip (NoC) is a scalable interconnection architecture for ever increasing communication demand between processing cores. However, in nanoscale technology size, NoC lifetime is limited due to aging processes of negative bias temperature instability, hot carrier injection, and electromigration. Usually, because of unbalanced utilization of NoC resources, some parts of the network experience more thermal stress and duty cycle in comparison with other parts, which may accelerate chip failure. To slow down the aging rate of NoC, this paper proposes an oblivious routing algorithm called location-based aging-resilient Xy-Yx (LAXY) to distribute packet flow over entire network. LAXY is... 

Nowadays networks-on-chip are emerging as a hot topic in IC designs with high integration. In addition to popular mesh and torus topologies, other structures can also be considered especially in 3D VLSI design. The shuffle-exchange topology is one of the popular interconnection architectures for multiprocessors due to its scalability and self-routing capability. By vertically stacking two or more silicon wafers, connected with a high-density and high-speed interconnect, it is now possible to combine multiple active device layers within a single IC. In this paper we propose an efficient three dimensional layout for a novel 2D mesh structure based on the shuffle-exchange topology. Simulation...