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Strain-rate dependent influence of adherend stiffness on fracture load prediction of BGA solder joints
, Article Engineering Fracture Mechanics ; Volume 186 , 2017 , Pages 119-133 ; 00137944 (ISSN) ; Akbari, S ; Farrahi, G ; Spelt, J. K ; Sharif University of Technology
Abstract
Fracture experiments with ball grid array (BGA) specimens having different adherend rigidities were performed under bending loads at intermediate strain rates (0.2–1 s−1) and a high strain rate of 30 s−1. A cohesive zone model (CZM) was established and the predictive capability of the model was assessed for the specimens with different rigidities. The predicted fracture loads were within 12% of the measured forces when the CZM parameters were obtained using specimens with a similar degree of constraint. This suggests that in many practical cases, the effect of adherend stiffness can be neglected in predicting the strength of BGA solder joints. © 2017 Elsevier Ltd