Sharif Digital Repository

The effect of temperature, pressure and bonding time on microstructure of temperature gradient transient liquid phase (TGTLP) diffusion bonded Al7075 alloy using liquid gallium interlayer was investigated. The selected bonding method relies on using the minimum amount of liquid gallium on faying surfaces, using a very fast heating rate to reach the joining temperature and imposing a temperature gradient across the bond region. The microstructure of the diffusion bonded joints was evaluated by light optical microscopy, scanning electron microscopy and energy dispersive spectroscopy (EDS). Results show that by increasing the temperature, pressure and time of joining, a more uniform... 

Double cantilever beam (DCB) specimens were prepared according to standard surface mount technology (SMT). The samples were stored inside an environmental chamber at two different relative humidity values (i.e. 40 or 100%) for either 2 or 4 h. Then they were aged at 25 °C, 75 °C or 125℃ for the same time. Finally, after being cooled to room temperature, fracture tests were performed under mode-I loading conditions at a strain rate of 0.03 s−1 at room temperature. Storage time did not have a significant effect on the fracture behavior. The fracture load and energy of the solder joints decreased significantly when the temperature was increased from 25 to 75℃. By further increase in the... 

Optimization of transient liquid phase (TLP) bonding variables is essential to achieve a joint free from deleterious intermetallic constituents as well as with appropriate mechanical properties. In this research, TLP bonding of FSX-414 superalloy was performed using the MBF-80 interlayer. The effects of bonding time (1-30. min) and gap size (25-100 μm) were studied on the joint microstructure and its mechanical properties. Continuous centerline eutectic phases, characterized as nickel-rich and chromium-rich borides, were observed at the joints with incomplete isothermal solidification. The globular and acicular phases were seen at diffusion affected zone (DAZ). These phases could be... 

The bonding temperature is an important parameter for optimization of the Transient Liquid Phase (TLP) bonding process in order to achieve a sound joint with good mechanical properties. However, the bonding temperature used can also be restricted by the microstructural stability of the base metal. In this study, the effect of bonding temperature (1050-1200 °C) on the joint microstructure and mechanical properties was studied for TLP bonding of FSX-414 superalloy using MBF-80 interlayer with thickness of 50 μm. Increasing bonding temperature from 1050 to 1150 °C caused reduction in the time required for complete isothermal solidification in agreement with models based on the diffusion induced... 

In this work, friction stir soldering (FSS) as a new approach for fabrication of copper/copper lap joints was introduced. This process is principally based on the friction stir processing (FSP) that can be performed using FSP tools with and without pin on the top sheet. In the present study, Pb-Sn foil was used as a solder which would be melted and then extruded in the area between the copper sheets during FSS process. This process was carried out using tools with and without pin at various rotation speeds of 1200, 1400, and 1600 rpm and traverse speed of 32 mm/min. Also, the same joint was fabricated using furnace soldering to compare the mechanical properties obtained with FSS and furnace... 

The effect of bonding temperature on microstructure of a transient liquid phase (TLP)-bonded GTD-111 nickel base superalloy, using a Ni-Si-B interlayer, was investigated. At low bonding temperatures microstructure of the joint centerline is controlled by B diffusion. However, at high bonding temperature effect of base metal alloying elements on the joint microstructure development was more pronounced. Effects of bonding temperature on the formation of secondary precipitates in diffusion-affected zone and isothermal solidification time were also analyzed. It was found that above a critical temperature, formation of borides in diffusion-affected zone is suppressed and the time required for... 

Al-Mg aluminum alloy was lap joined to aluminum clad steel sheet using pulsed gas tungsten arc welding process and Al-Si filler metal. The effects of the welding heat-input were investigated on the joint microstructure and mechanical properties. Weld metal microstructure, formation of intermetallic compounds (IMCs) at the joint interface and the fracture locations were studied using stereo, optical and scanning electron microscopy (SEM) equipped with energy dispersive X-ray spectroscopy (EDS). The joint strength of the welds was evaluated by shear-tensile test. The results showed that presence of a thin aluminum clad layer with 350 μm thickness drastically decreased the Al-Fe intermetallic...