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Effect of bonding parameters on microstructure development during TGTLP bonding of Al7075 alloy
, Article Philosophical Magazine ; Vol. 94, issue. 11 , Mar , 2014 , pp. 1166-1176 ; ISSN: 14786435 ; Ekrami, A ; Farahany, S ; Jahangiri, A ; Sharif University of Technology
Abstract
The effect of temperature, pressure and bonding time on microstructure of temperature gradient transient liquid phase (TGTLP) diffusion bonded Al7075 alloy using liquid gallium interlayer was investigated. The selected bonding method relies on using the minimum amount of liquid gallium on faying surfaces, using a very fast heating rate to reach the joining temperature and imposing a temperature gradient across the bond region. The microstructure of the diffusion bonded joints was evaluated by light optical microscopy, scanning electron microscopy and energy dispersive spectroscopy (EDS). Results show that by increasing the temperature, pressure and time of joining, a more uniform...