Sharif Digital Repository

A novel substrateless power amplifier module realized by ridge gap waveguide (RGW) technology is proposed in Ka-band. Up to our knowledge, this is the first time that an active device is directly integrated with an RGW structure. No substrate is used in the RF section of the implemented power amplifier and the whole structure is made by machining a piece of metal. The amplifier was made of two pieces and was easily assembled without needing a precise contact between the two sections. The cavity resonance of the amplifier is suppressed using a pining structure. The fabricated amplifier module is self-packaged and does not need any packaging. It is shown that the simulated and measured results... 

In this brief, an imaging methodology for mono-static millimeter-wave systems is introduced. When the measured object hologram is piece-wise smooth with sharp boundaries, both low-pass and high-pass components are present in a transform domain. Nevertheless, the edges are sparse in transform domain with respect to the image dimensions. It is shown that the down-sampling of the hologram with an appropriate rate determined by the sparsity level, includes the adequate information of all components for image reconstruction. Using random samples, an algorithm is proposed to recover all the sparse components, iteratively. Simulation results illustrate that a high-resolution recovery can be... 

This paper presents a sequence of affordable methods applied to diagnose a millimeter-wave system-in-package. The module used in this paper is a 60 GHz transceiver with a waveguide interface, designed to transmit 8 dBm of saturated power. It consists of a flip-chipped RFIC, a multi-layer organic substrate, a metal enclosure with a standard waveguide interface, passive components and a 30-pin connector. The first measured output power was 3 to 6 dB below the desired value over the 60 GHz band. Thus, all parts of the module were thoroughly investigated to detect the cause of power drop. By 3-D electromagnetic simulation of the enclosure, the cavity modes and power leakage in the enclosure were...