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nanocomposite-solder
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Nanoindentation creep behavior of nanocomposite Sn-Ag-Cu solders
, Article Journal of Electronic Materials ; Volume 41, Issue 8 , 2012 , Pages 2057-2064 ; 03615235 (ISSN) ; Kokabi, A. H ; Miyashita, Y ; Mutoh, Y ; Ihara, I ; Guan Fatt, R. G ; Madaah Hosseini, H. R ; Sharif University of Technology
Abstract
High-density, ultrasmall-pitch electronic applications require miniaturized solder bumps with improved thermomechanical performance. In addition, novel techniques which are able to precisely characterize these solder bumps are needed. One approach to meeting both of these requirements is to make use of recently developed nanocomposite solders with enhanced creep resistance, and to characterize these solders using a nanoindentation technique. In the present study, the creep behavior of ceria-reinforced nanocomposite solder foils fabricated by the accumulative roll-bonding process was characterized using a depth-sensing nanoindentation technique. It was found that the creep resistance of the...
Production of Sn Base Composite Solder Reinforced by Nanoparticles Via Melt-spinning Technique
, M.Sc. Thesis Sharif University of Technology ; Tavakkoli, Rouhollah (Supervisor)
Abstract
Lead-containing solder alloys in particular Sn-37Pb is the most common alloy used in electronics industry, this alloy has the good mechanical properties and excellent wetting properties and low prices. Recently, increasing environmental and health concerns over the toxicity of lead combined with strict legislation to ban the use of lead-based solders have provided an inevitable driving force for the development of lead-free solder alloys. A group of these lead-free solders are nanocomposite solders that because of having the reinforcement nano particles exhibit lots of unique properties, such as good mechanical and thermal properties. The aim of this research produce a new tin base...
Disabling of nanoparticle effects at increased temperature in nanocomposite solders
, Article Journal of Electronic Materials ; Volume 41, Issue 7 , 2012 , Pages 1907-1914 ; 03615235 (ISSN) ; Roshanghias, A ; Ashayer, R ; Kotadia, H. R ; Khomamizadeh, F ; Kokabi, A. H ; Clode, M. P ; Miodownik, M ; Mannan, S. H ; Sharif University of Technology
2012
Abstract
The use of nanoparticles to control grain size and mechanical properties of solder alloys at high homologous temperature is explored. It is found that silica nanoparticles in the 100 nm range coated with 2 nm to 3 nm of gold can be dispersed within solders during the normal reflow soldering process, and that these particles are effective in hardening the solder and restricting dynamic grain growth during compression testing at low homologous temperature. As the homologous temperature increases towards 0.75, the effects of the nanoparticles on both mechanical properties and dynamical grain growth reduce, and by homologous temperatures of 0.86 the effects have completely disappeared. This...
Fabrication and Characterization of Sn-Ag-Cu Solder Reinforced with Al2O3 Nano Particles Employing Mechanical Alloying
, M.Sc. Thesis Sharif University of Technology ; Kokabi, Amir Hossein (Supervisor) ; Simchi, Abdolreza (Supervisor)
Abstract
Many regulations have been introduced over the world to urge the elimination of lead and lead containing solders, due to increasing pressure of the environmental and health concerns associated with lead-containing solders in the electronics industry. Therefore, efforts to develop and promote lead-free soldering have recently intensified. Conventional solder technology may not guarantee the required performance at such pitches due to problems such as higher diffusivity and the softening nature of the solder. To solve these problems, efforts have been made to develop solders with a low melting point, higher strength, better microstructure properties, and high creep resistance. Recently...
Wettability and rheological behavior of low Ag lead-free SAC/graphene and cobalt-graphene nanocomposite solder paste
, Article Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science ; Volume 53, Issue 8 , 2022 , Pages 2811-2822 ; 10735623 (ISSN) ; Movahedi, M ; Kokabi, A. H ; Miyashita, Y ; Azghandi Rad, S ; Sharif University of Technology
Springer
2022
Abstract
The impacts of dopant nanoparticles, graphene nanosheets (GNSs) and cobalt decorated-graphene nanosheets (CoGNSs), were studied in relation to the wettability and rheological behavior in low-Ag lead-free SAC0307 (Sn–0.3Ag–0.7Cu) solder paste. The solidification range of the solders was evaluated using differential scanning calorimetry. Phase identification in the solder bulk and interface of the solder and copper substrate was carried out by X-ray diffraction and energy-dispersive X-ray spectroscopy. Spreading properties and reactive wetting behavior along with the rheological properties of the solders were also studied. Results showed that the addition of both nanoparticles did not...
Ceria reinforced nanocomposite solder foils fabricated by accumulative roll bonding process
, Article Journal of Materials Science: Materials in Electronics ; Volume 23, Issue 9 , September , 2012 , Pages 1698-1704 ; 09574522 (ISSN) ; Kokabi, A. H ; Miyashita, Y ; Mutoh, Y ; Rezayat, M ; Madaah Hosseini, H. R ; Sharif University of Technology
Springer
2012
Abstract
As one of the key technologies for high performance electronic devices, composite solders have been recently developed to improve thermal and mechanical properties of solder joints. In this study, accumulative roll bonding process was used as an effective alternative method for manufacturing high-strength, finely dispersed, void-free and highly uniform Sn-Ag-Cu/CeO 2 nanocomposite solders. Microstructural investigation of nanocomposite solders revealed that homogenous distribution of CeO 2 nanoparticle has been achieved and the eutectic as-cast morphology of the solder changed to recrystallized fine grained structure. As a result of severe plastic deformation during rolling, brittle and...