Sharif Digital Repository

The paper aims at addressing the effect of the bonding time on the metallurgical and mechanical properties of a transient-liquid-phase (TLP) bonded IN718 nickel-based superalloy using an Ni-15.2Cr-4B (%) amorphous filler alloy. The results showed that after a partial isothermal solidification, the residual liquid in the joint centerline transformed, during the cooling, to non-equilibrium eutectic-type microconstituents composed of Ni-rich boride, Cr-rich boride and eutectic γ-solid solution phase. The complete isothermal solidification which resulted in a formation of an intermetallic-free joint centerline occurred after a holding period 40 min at the bonding temperature of 1100 °C. An... 

In this research, production of ferrite - martensite dual phase Steels with different martensite morphology was considered during transient liquid phase bonding of a low carbon steel. The steel was bonded using an iron base interlayer with melting point of 1443 K and 40 μm thickness. Bonding process carried out at 1473 K, under pressure of 0.5 MPa, at different holding time of 10, 20, 30 and 40 minutes. Microstructural studies of joint region showed that isothermal solidification completed at the bonding time of 40 minutes. Microstructure of joints made at the bonding time of 10, 20, and 30 minutes consists of two distinct region, athermal and isothermal solidified zones. Microstructure of... 

In transient liquid phase (TLP) bonding for commercial applications, one of the important key parameters is the holding time required for complete isothermal solidification tIS, which is a prerequisite for obtaining a proper bond microstructure. The objective of the study is to analyse the isothermal solidification kinetics during TLP bonding of cast IN718 nickel based superalloy. Experiments for TLP bonding were carried out using a Ni-7Cr-4.5Si-3Fe-3.2B (wt-%) amorphous interlayer at several bonding temperatures (1273-1373 K). The time required to obtain TLP joints free from centreline eutectic microconstituents was experimentally determined. Considering the solidification behaviour of... 

This paper aims at addressing the microstructure-strength characteristics relationship during transient liquid phase (TLP) bonding of cast IN718 nickel based superalloy using Ni-7. Cr-4.5. Si-3. Fe-3.2. B (wt%) amorphous interlayer. The progress of the isothermal solidification at different temperatures for different times is analyzed using a Larson-Miller parameter (LMP). It was found that there is direct relationship between isothermal solidification zone (ISZ) size and LMP. Results showed that in situation where isothermal solidification has not been completed, the ratio of athermal solidification zone (ASZ) size to the width of the total solidified zone is the controlling factor for... 

Aging response of transient liquid phase Nb bearing wrought IN718 nickel base superalloy is studied. The aging behaviour of the joint is influenced by low Nb+Al+Ti content of isothermal solidification zone (ISZ) and formation of Nb-Cr-Mo based boride precipitates in diffusion affected zone (DAZ). It was shown that applying a post-bond heat treatment which was able to eliminate the diffusion induced boride precipitates in DAZ and increase the Nb+Al+Ti content of the ISZ improved the aging response and shear strength of the joint  

The time required to ensure completion of the isothermal solidification process is the key in obtaining an intermetallic free and robust joint after diffusion brazing. In view of economic considerations, it is interesting to perform bonding process trials using standard heat treatment cycles. This paper addresses the effect of applying the standard heat treatment cycle including homogenisation, solution and double aging treatments on the microstructural and mechanical response of diffusion brazed IN718. A commercial Ni-7Cr-4·5Si- 3?2B-3Fe (wt-%) brazing alloy was used as the interlayer. Results showed that bonds made with the standard homogenisation treatment, at 1100°C, exhibited a eutectic... 

This paper addresses solidification and solid state precipitation phenomena during transient liquid phase (TLP) bonding of wrought IN718 nickel base superalloy using Ni-4.5Si-3.2B (wt.%) ternary filler alloy. The solidification sequence of the residual liquid in the joint centerline was found to be (1) formation of proeutectic γ, followed by (2) γ/Ni3B eutectic reaction, followed by (3) ternary eutectic of γ/Ni 3B/Ni6Si2B. Extensive fine Ni3Si formed within the eutectic-γ via solid state precipitation during cooling. Extensive Cr-Mo-Nb rich boride precipitates were formed in the substrate region due to boron diffusion into the base metal during bonding process. The implications of the phase... 

Transient liquid phase (TLP) diffusion bonding is a preferred joining/repairing technique for nickel based superalloy. In this research, TLP bonding process carried out according to the standard heat treatment cycles for wrought IN718 base material in order to permit the combining of these two thermal operations. The results showed that the standard solution treatments at 1000 and 1050. °C for 60. min can result in completion of isothermal solidification in IN718/Ni-Cr-Fe-Si-B/IN718 system producing an entirely intermetallic free joint centerline. Two distinct microstructural zones were formed in the bonding affected zone: isothermal solidification zone (ISZ) which consists of single phase... 

Transient liquid phase (TLP) bonding of Al2024-T6 alloy, using gallium (Ga) interlayer, has been investigated. Bonding process was carried out at 470°C for 6 min, and homogenising temperature and time were 495°C and 2 h respectively. Conventional TLP bonding using Ga interlayer was not an appropriate method for joining of Al2024. In this method, the boundary between two Al2024 specimens was not fully eliminated during bonding because of solidification with planar front. In addition, bonding zone was depleted of copper, and as a result, tensile and shear strength of joint decreased to 200 and 110 MPa respectively. TLP bonding under temperature gradient offered very good results in bonding of... 

Co-based FSX-414 superalloy is especially used for first-stage nozzles of gas turbines. Transient liquid phase (TLP) bonding has potential as repair process for these nozzles. In this study, homogenization of TLP-bonded FSX-414 superalloy at optimum bonding condition (1150 °C/5 min) was conducted at 1175, 1200, and 1225 °C for 1, 3, and 6 h. Homogenization at 1175 °C/1 h had no effect on removing the diffusion-affected zone (DAZ) phases. Increasing the time to 6 h was effective in removing DAZ phases and boride phases formed due to liquefaction, but compositional homogenization was not complete. Homogenization at 1200 °C for 1 h caused boride phases to form adjacent to the joint and in the... 

Transient liquid phase bonding of AISI 304 austenitic stainless steel was carried out using a Co-based interlayer with 40 μm thickness. The effect of bonding time and solid-state homogenisation time on the microstructure and mechanical properties of samples was investigated. The results showed that isothermal solidification was completed within 30 min at a constant temperature of 1180°C. With increasing homogenisation time, at 1000°C, a more uniform distribution of alloying elements and hardness profile across the joint region was achieved. The average shear strength of homogenised samples was about 72% that of the base metal at the same heat treatment cycle. © 2017 Institute of Materials,... 

The key feature of diffusion brazing, also referred to as transient liquid phase bonding, is isothermal solidification which precludes the formation of intermetallic in the joint centreline. Analysing the available data published in the literature showed that the composition of the nickel-based superalloys plays a strong role in determining the required time for obtaining intermetallic-free joint during diffusion brazing. This effect is not predictable by the standard conventional models. It is proposed that increasing the boride-forming elements in the base superalloy which promotes in situ boride precipitation at the diffusion-affected zone can accelerate the diffusion flux of the boron... 

This investigation aims at understanding the underlying fundamentals of the isothermal solidification phenomenon during the transient liquid phase (TLP) bonding process. The isothermal solidification is governed by solid-state diffusion of the melting point depressant (MPD) into the base material, which, in turn, is controlled by both kinetic and thermodynamic parameters; however, the latter factor is generally ignored. In this work, the competition between kinetics and thermodynamics of diffusion were considered in TLP bonding of a nickel alloy, Monel 400, using two distinct filler metals including pure copper (Cu) and Ni-Si-B filler metal. The joint generated by Ni-Si-B filler metal... 

The application of the multi-component Fe-based filler metals (FMs) for transient liquid phase (TLP) bonding of AISI 304 austenitic stainless steel has been overshadowed by dissimilar interlayers merely due to their shorter isothermal solidification time. However, the latter usually suffers from low efficiency in terms of mechanical properties even after homogenization of heat treatment. This study shows that by imposing a temperature gradient across the bond line during the TLP bonding process (TG-TLP), it is possible to reduce the isothermal solidification time significantly. This renews the interest in utilizing multi-component Fe-based FMs. In this regard, the TG-TLP bonding process was... 

Understanding diffusion-induced isothermal solidification time during transient liquid phase bonding is vital in producing intermetallic-free robust joints. The isothermal solidification completion time is overestimated by the existing analytical models, even by the closest one to the real bonding conditions, known as the moving interface model. It was found that the boride formation in the diffusion affected zone of Ni-based superalloy upon using B-containing filler metals is one of the reasons behind the inability of the moving interface model to predict the isothermal solidification completion time accurately, which has received scant attention in the literature. Moreover, simplified... 

Optimization of transient liquid phase (TLP) bonding variables is essential to achieve a joint free from deleterious intermetallic constituents as well as with appropriate mechanical properties. In this research, TLP bonding of FSX-414 superalloy was performed using the MBF-80 interlayer. The effects of bonding time (1-30. min) and gap size (25-100 μm) were studied on the joint microstructure and its mechanical properties. Continuous centerline eutectic phases, characterized as nickel-rich and chromium-rich borides, were observed at the joints with incomplete isothermal solidification. The globular and acicular phases were seen at diffusion affected zone (DAZ). These phases could be... 

The bonding temperature is an important parameter for optimization of the Transient Liquid Phase (TLP) bonding process in order to achieve a sound joint with good mechanical properties. However, the bonding temperature used can also be restricted by the microstructural stability of the base metal. In this study, the effect of bonding temperature (1050-1200 °C) on the joint microstructure and mechanical properties was studied for TLP bonding of FSX-414 superalloy using MBF-80 interlayer with thickness of 50 μm. Increasing bonding temperature from 1050 to 1150 °C caused reduction in the time required for complete isothermal solidification in agreement with models based on the diffusion induced... 

The as-cast samples of FSX-414 Co-based superalloy were heat treated at the standard solution and aging heat treatment cycles. Specimens for joining were cut from the as-cast ingot. Transient liquid phase (TLP) bonding was carried out at the standard solution cycle, using MBF-30 interlayer. Also, bonded specimens were homogenized at the standard aging condition. The microstructure of the as-cast, heat treated and TLP bonded specimens were studied. These studies showed that the non-uniform distributed carbides of the as-cast specimen were replaced by uniform ones during the heat treatment. Eutectic M 23C 6 carbides were observed in all specimens. Due to the complete isothermal solidification,... 

Transient liquid phase (TLP) bonding is a joining process which combines benefits of diffusion bonding and brazing. Therefore, this method has widely been used in joining of materials which are sensitive to fusion welding. Interlayer composition, as one of the most important factors of TLP bonding, can affect the bonding region composition, microstructure, and hence mechanical properties of the joint. In this research, Fe-based, Ni-based, and commercially pure Cu interlayers are used to bond low-carbon steel components which are then heat treated to produce dual phase steel. The present work focuses on two main goals. Firstly, drawing a comparison of microstructure and mechanical properties... 

The microstructure of a transient liquid phase (TLP) bonded nickel base superalloy using B-containing filler metal after completion of isothermal solidification can usually be described by a eutectic-free joint centerline with extensive in-situ boride precipitation in the diffusion affected zone which in turn can affect the joint properties. Therefore, designing a proper post-bond heat treatment is needed to produce a robust joint. This paper addresses the microstructure evolution mechanism during post-bond heat treatment (PBHT) of TLP bonded wrought IN718 nickel base superalloy. PBHT at 1150 °C, which is lower than the solvus temperature of the borides, for 12 h resulted in boride-free...