NumericalModel for Surface Scattering and Grain Boundary Scattering of Metallic Wires

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Abbaspour, Elhame | 2012

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Type of Document: M.Sc. Thesis
Language: Farsi
Document No: 43459 (05)
University: Sharif University of Technology
Department: Electrical Engineering
Advisor(s): Sarvari, Reza
Abstract:
Recently, the size of copper interconnects is going to reach lower than the mean free path of electrons for copper. In this situation, we should consider the effect of other scattering mechanisms as well as thermal scattering on copper thin films. In this work we study both DC size effect and anomalous skin effect on resistivity by a Monte Carlo method. Contribution of each scattering mechanism and the interaction between them are analyzed separately. The structure of electrical field and distribution of current in thin films have also been studied. Investigating of the effect of exact nature of surface scattering and grain boundary scattering on resistivity is one of the interests of this project. In this work we have found good agreements between proposed numerical model and existing analytical formulas.
Keywords:
Copper ; Interconnect Network ; Surface Scattering ; Grain Boundary Scattering