An Investigation into the Production and Properties of Lead-Free Solder Alloy Sn-3.5Ag

Please enable javascript in your browser.

Ghadi, Saman | 2014

640 Viewed

Type of Document: M.Sc. Thesis
Language: Farsi
Document No: 45444 (07)
University: Sharif University of Technology
Department: Material Science and Engineering
Advisor(s): Karimi Taheri, Ali
Abstract:
This study was conducted in order to investigate on production and propeties of lead free solder alloy. For this purpose, Sn-Ag alloy with 3.5 weight percent of silver and sn-3.5Ag-0.7Cu at eutectic composition were produced with casting procedure.Single-lap Specimens were used to simulate real solder joints with the solder reflowed between two pure Cu substrate.Microstructural characterization, electrical resistance measurements and shear-tension test were performed.A deacrease of electrical resistance was observed in produced alloys in comparison with Sn-Pb . Experimental results showed that mechanical properties of produced alloys was better than common pb content alloy.The effect of solder thickness, joint pressure and soldering time on microstructure were investigated for each solder. The results showed that the thickness of IMCs decreased with increasing thickness of solder. In addition, the thickness of IMCs observed in microscopic images increased with increasing soldering time
Keywords:
Intermetallic Compounds ; Lead Free Solders ; Soldering ; Electrical Resistivity ; Tin-Lead Alloy ; Solder Electrical Resistance

No TOC