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An Investigation on Microstructure and Mechanical Properties of TLP Bonded Al/SiC Composite Using Powder Technique

Khaksari Noori, Mohammad | 2014

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  1. Type of Document: M.Sc. Thesis
  2. Language: Farsi
  3. Document No: 45664 (07)
  4. University: Sharif University of Technology
  5. Department: Materials Science and Engineering
  6. Advisor(s): Ekrami, A.A; Bagheri, REZA
  7. Abstract:
  8. In this research Al6061-SiC composite bonding was done by transient liquid phase method using powder copper intermediate layer. In the first stage feasibility of making this junction in ambient condition was studied. In order to find process optimum temperature, experiments were performed in 560°C, 570°C, 580°C and 590°C for 2 hours. Optical microscopy, scanning electron microscopy and EDS analysis were utilized for this study. Moreover, shear strength determination test was done to assess and compare mechanical properties and also to determine the optimum bonding temperature.
    In second stage, base composite and bonded specimens were homogenized in 530°C for 5 and 10 hours. Effect of homogenization on microstructure was studied using optical microscope, SEM and EDS analysis. Micro-hardness test was applied for investigating microstructure variation and mechanical properties by examining further distances from bonding zone. To have a more accurate study on homogenization effect and also to compare properties achieved from bonding by powder intermediate layer with foil intermediate layer and base composite, results from shear strength determination test were analyzed. At last fracture surfaces of jointed specimens were studied by optical and scanning electron microscopes and their fractographic aspects were reviewed.
  9. Keywords:
  10. Microstructure ; Mechanical Properties ; Homogenization ; Aluminum-Silicon Carbide Composite ; Transient Liquid Phase (TLP) ; Copper Powder Interlayer

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