An Investigation on Microstructure and Mechanical Properties of TLP Bonded Al/SiC Composite Using Powder Technique, M.Sc. Thesis Sharif University of Technology ; Ekrami, A.A (Supervisor) ; Bagheri, REZA (Supervisor)
Abstract
In this research Al6061-SiC composite bonding was done by transient liquid phase method using powder copper intermediate layer. In the first stage feasibility of making this junction in ambient condition was studied. In order to find process optimum temperature, experiments were performed in 560°C, 570°C, 580°C and 590°C for 2 hours. Optical microscopy, scanning electron microscopy and EDS analysis were utilized for this study. Moreover, shear strength determination test was done to assess and compare mechanical properties and also to determine the optimum bonding temperature.
In second stage, base composite and bonded specimens were homogenized in 530°C for 5 and 10 hours. Effect of... Cataloging briefAn Investigation on Microstructure and Mechanical Properties of TLP Bonded Al/SiC Composite Using Powder Technique, M.Sc. Thesis Sharif University of Technology ; Ekrami, A.A (Supervisor) ; Bagheri, REZA (Supervisor)
Abstract
In this research Al6061-SiC composite bonding was done by transient liquid phase method using powder copper intermediate layer. In the first stage feasibility of making this junction in ambient condition was studied. In order to find process optimum temperature, experiments were performed in 560°C, 570°C, 580°C and 590°C for 2 hours. Optical microscopy, scanning electron microscopy and EDS analysis were utilized for this study. Moreover, shear strength determination test was done to assess and compare mechanical properties and also to determine the optimum bonding temperature.
In second stage, base composite and bonded specimens were homogenized in 530°C for 5 and 10 hours. Effect of... Find in contentBookmark |
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