Thermal Fatigue Investigation of Different Geometrical Aspect of via in Integrated Circuits

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Ahmadi, Behnoud | 2014

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Type of Document: M.Sc. Thesis
Language: Farsi
Document No: 46430 (45)
University: Sharif University of Technology
Department: Aerospace Engineering
Advisor(s): Adib Nazari, Saeid
Abstract:
The reliability of integrated circuits (IC) is related to material imperfections such as holes, cavities, cracks and etc. which occur in the manufacturing process. The operational conditions of IC create thermal stresses. These thermal stresses increase the chance of failure by making the imperfections critical in IC’s components such as VIA that is used as connection between interconnects in the multilevel integrated circuits. As a result, thermal fatigue needs to be investigated in VIA thoroughly.
The thermal stresses in VIA increase the possibility of hole forming due to hydrostatic stresses during manufacturing process and the amplitude of applied stresses under the operational conditions will cause thermal fatigue in VIA. So, in this thesis the effect of geometrical parameters (Height and diameter) on the manufacturing process and the operational conditions will be investigated. These effects have been determined by CAD modeling and analyses in ABAQUS as a FEM software and the best height to diameter ratio has been calculated for VIA to decrease chance of failures in this component
Keywords:
Thermal Stress ; Thermal Fatigue ; Integrated Circuit ; VIA

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