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Optimal Multi-Level Interconnect Architecture for GSI Using Novel Solutions Replacing Copper

Kishani Farahani, Esmat | 2013

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  1. Type of Document: Ph.D. Dissertation
  2. Language: Farsi
  3. Document No: 46777 (05)
  4. University: Sharif University of Technology
  5. Department: Electrical Engineering
  6. Advisor(s): Sarvari, Reza
  7. Abstract:
  8. Although a lot of research has been done on Carbon-based interconnect, there are many important questions unanswered. For example, there is no compact model for the resistance of bundle of CNTs at high frequencies, at which interconnects will be operating due to the scaling. Also there are many studies comparing CNT, GNR, and Cu wires but there is no study to show how much this will impact the design of a chip at today’s Giga Scale Integration. This comprehensive study should include chip performance, power dissipation and total number of metal levels. These two big questions are investigated in this dissertation. In the first part, high frequency behavior of CNT bundles is studied. A compact model for resistivity of bundle of multi-wall CNTs are derived considering skin- and proximity-effects. In the second part, considering wire distribution of wires, interconnect network of the chip is designed using carbon based interconnects. Our results show 25% and 27% reduction in the power dissipation and the number of metal levels. An algorithm and a comprehensive criterion are introduced to design multi-level interconnect network of macrocells using combination of Cu and carbon based interconnects. The comprehensive criteria considers power dissipation, wire density, and metal level number simulteniously in determining interconnect type for each metal level
  9. Keywords:
  10. Carbon Nanotubes ; Interconnect ; Graphene Nanoribbons ; Proximity Effect ; Multilevel Interconnects Network ; Skin Effect

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