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Effect of copper content on tensile mechanical properties of ternary NiTiCu alloy nanowire: molecular dynamics simulation

Fazeli, S ; Sharif University of Technology | 2018

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  1. Type of Document: Article
  2. DOI: 10.1016/j.matpr.2017.11.245
  3. Publisher: Elsevier Ltd , 2018
  4. Abstract:
  5. Molecular dynamics (MD) simulation was used to study of mechanical properties of NiTiCu with different content of copper. It was shown that the percent composition of copper are significantly affects the stress-strain curves curve. The results showed that as the Cu content increased, the Yield Strength and Young's modulus decreased. © 2017 Elsevier Ltd
  6. Keywords:
  7. LAMMPS ; Mechanical properties ; Molecular dynamics simulation ; NiTiCu
  8. Source: Materials Today: Proceedings ; Volume 5, Issue 1 , 2018 , Pages 1552-1555 ; 22147853 (ISSN)
  9. URL: https://www.sciencedirect.com/science/article/pii/S2214785317325130