Experimental Study and Finite Element Modeling of the Effect of Microstructure on Fracture Behavior and Fracture Load Prediction of Solder Joints, M.Sc. Thesis Sharif University of Technology ; Farrahi, Gholamhossein (Supervisor) ; Nourani, Amir (Supervisor)
Abstract
The critical strain energy release rate for the solder joint fracture was measured as a function of cooling rate, time above liquidus (TAL) and soldering temperature. The specimens were prepared at 4 different levels of cooling rate, 3 varying levels of TAL, and 3 soldering temperature levels. Then, experiments were designed using the Taguchi method. Fracture tests were performed under bending at a strain rates of 10-5 and 0.5 s-1 and mode I loading conditions. It was found that the effect of soldering temperature insignificant on the Jci, but the cooling rate and the TAL due to their many effects were also studied by their interaction effects. It was observed that at the cooling rate of...
Cataloging briefExperimental Study and Finite Element Modeling of the Effect of Microstructure on Fracture Behavior and Fracture Load Prediction of Solder Joints, M.Sc. Thesis Sharif University of Technology ; Farrahi, Gholamhossein (Supervisor) ; Nourani, Amir (Supervisor)
Abstract
The critical strain energy release rate for the solder joint fracture was measured as a function of cooling rate, time above liquidus (TAL) and soldering temperature. The specimens were prepared at 4 different levels of cooling rate, 3 varying levels of TAL, and 3 soldering temperature levels. Then, experiments were designed using the Taguchi method. Fracture tests were performed under bending at a strain rates of 10-5 and 0.5 s-1 and mode I loading conditions. It was found that the effect of soldering temperature insignificant on the Jci, but the cooling rate and the TAL due to their many effects were also studied by their interaction effects. It was observed that at the cooling rate of...
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