Microstructure/Properties Relationship in Lead Free Solder Joint Reinforced with Graphene Nanosheets, M.Sc. Thesis Sharif University of Technology ; Kokabi, Amir Hossein (Supervisor) ; Movahedi, Mojtaba (Supervisor)
Abstract
Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental reasons, a significant challenge was created in the design and development of tin-based lead-free solders with physical and mechanical properties close to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic composition and related compounds have been proposed as alloys to replace Sn-Pb solders. As a lead-free solder alloy, low melting point (≈217℃), high reliability of joints, and compatibility with various fluxes are among the properties of this category of alloys. In order to improve the mechanical properties of the joint...
Cataloging briefMicrostructure/Properties Relationship in Lead Free Solder Joint Reinforced with Graphene Nanosheets, M.Sc. Thesis Sharif University of Technology ; Kokabi, Amir Hossein (Supervisor) ; Movahedi, Mojtaba (Supervisor)
Abstract
Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental reasons, a significant challenge was created in the design and development of tin-based lead-free solders with physical and mechanical properties close to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic composition and related compounds have been proposed as alloys to replace Sn-Pb solders. As a lead-free solder alloy, low melting point (≈217℃), high reliability of joints, and compatibility with various fluxes are among the properties of this category of alloys. In order to improve the mechanical properties of the joint...
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