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Nanoparticle enhanced solders for increased solder reliability

Mokhtari, O ; Sharif University of Technology | 2012

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  1. Type of Document: Article
  2. DOI: 10.1557/opl.2012.832
  3. Publisher: 2012
  4. Abstract:
  5. Due to environmental concerns traditional eutectic tin-lead solder is gradually being replaced in electronic assemblies by "lead-free" solders. During this transition, nanoparticle technology is also being investigated to see whether improvements in joint reliability for high temperature applications can be made. Nanoparticles can be used to harden the solder via Zener pinning of the grain boundaries and reduce fatigue failure. This paper explores the effects of adding Silica nanoparticles to SnAgCu solder, and how the mechanical properties induced in the solder vary with temperature. It is found that above 100°C the mechanical response and microstructure of the normal and nanoparticle enhanced solders converge
  6. Keywords:
  7. Electronic assemblies ; Environmental concerns ; Fatigue failures ; Joint reliability ; Lead-Free ; Mechanical response ; Nanoparticle technologies ; Silica nanoparticles ; SnAgCu solder ; Solder reliability ; Tin-lead solders ; Zener-pinning ; Grain boundaries ; Lead ; Mechanical properties ; Nanoparticles ; Tin ; Soldering alloys
  8. Source: Materials Research Society Symposium Proceedings, 28 November 2011 through 2 December 2011, Boston, MA ; Volume 1424 , 2012 , Pages 115-120 ; 02729172 (ISSN) ; 9781605114019 (ISBN)
  9. URL: http://journals.cambridge.org/action/displayAbstract?fromPage=online&aid=8575558&fileId=S1946427412008329