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Effect of solidification mechanism on microstructure and mechanical properties of joint in TLP bonded Al2024-T6 alloy
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Effect of solidification mechanism on microstructure and mechanical properties of joint in TLP bonded Al2024-T6 alloy

Ghaznavi, M. M

Effect of solidification mechanism on microstructure and mechanical properties of joint in TLP bonded Al2024-T6 alloy

Ghaznavi, M. M ; Sharif University of Technology | 2011

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  1. Type of Document: Article
  2. DOI: 10.1179/1362171810Y.0000000013
  3. Publisher: 2011
  4. Abstract:
  5. Transient liquid phase (TLP) bonding of Al2024-T6 alloy, using gallium (Ga) interlayer, has been investigated. Bonding process was carried out at 470°C for 6 min, and homogenising temperature and time were 495°C and 2 h respectively. Conventional TLP bonding using Ga interlayer was not an appropriate method for joining of Al2024. In this method, the boundary between two Al2024 specimens was not fully eliminated during bonding because of solidification with planar front. In addition, bonding zone was depleted of copper, and as a result, tensile and shear strength of joint decreased to 200 and 110 MPa respectively. TLP bonding under temperature gradient offered very good results in bonding of Al2024. In this method, solidification mechanism change from planar to dendritic, and tensile and shear strength of joint increased to about 460 and 220 MPa respectively. Microstructure of bonding zone changed basically by changing solidification mechanism
  6. Keywords:
  7. Gallium ; Solidification ; Temperature gradient ; TLP bonding ; Al2024 ; Bonding process ; Bonding zone ; Microstructure and mechanical properties ; Shear strength of joint ; Transient liquid phase bonding ; Cerium alloys ; Mechanical properties ; Microstructure ; Shear strength ; Tensile strength ; Thermal gradients ; Gallium alloys
  8. Source: Science and Technology of Welding and Joining ; Volume 16, Issue 2 , Nov , 2011 , Pages 174-180 ; 13621718 (ISSN)
  9. URL: http://www.tandfonline.com/doi/full/10.1179/1362171810Y.0000000013#.V2ZUGRK5JIE