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Improvement of Polymer Composites Thermal Conductivity by Nanoparticles

Kazemi Ranjbar, Sina | 2020

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  1. Type of Document: M.Sc. Thesis
  2. Language: Farsi
  3. Document No: 54133 (08)
  4. University: Sharif University of Technology
  5. Department: Mechanical Engineering
  6. Advisor(s): Nouri Broujerdi, Ali
  7. Abstract:
  8. The new generation of electronic devices including 5G internet, wearable electronics, LED optoelectronics or cloud computing devices have higher power density as their computing power increases and their sizes reduce. The increase in power density leads to higher heat generation and consequently higher operating temperature which reduces their lifetime and reliability. In recent years development of novel solutions for electronic cooling has been persued. Thermal interface material that inserted between heat source and heat sink is the main component in electronic cooling. These materials consists of a polymeric base that filled with highly thermally conductive solid particles. By emergence of novel nanomaterials like graphene and carbon nanotube with exceptional thermal properties, attentions turned toward using these materials in polymer composites which have good thermal properties. In this project hybrid graphene and silicon carbide has been been used as filler in polymer composite for imporving its thermal conductivity. The measurement results indicate that thermal conductivity enhancement of composite with hybrid filler considerably affected size ratio of two filler. In addition abrupt changes in thermal conductivity has been observed by increasing filler loading. In epoxy composite with 11% graphene(ratio of graphene volume to composite volume) and 9% SiC with 1µm size thermal conductivity increases from 0.22 W.m-1.K-1 to 3.44 W.m-1.K-1. However in composite with 20% graphene loading thermal conductivity reaches 2.42 W.m-1.K-1
  9. Keywords:
  10. Electronic Cooling ; Silicon Carbide ; Polymer Composites ; Thermal Conductivity ; Carbon Nanoparticles

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