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The influence of pulse plating parameters on the electrocodeposition of Ni-TiO2 nanocomposite single layer and multilayer structures on copper substrates
, Article Surface and Coatings Technology ; Volume 262 , 2015 , Pages 173-183 ; 02578972 (ISSN) ; Dolati, A ; Ghorbani, M ; Sharif University of Technology
Elsevier
2015
Abstract
The electrocodeposition of Ni-TiO2 nanocomposite single layers and Ni-TiO2/TiO2 multilayers from a Watts bath containing a TiO2 sol on copper substrates was investigated by different deposition techniques. Compared with direct current (DC) deposition, both pulse plating (PP) and pulse reverse plating (PRP) facilitated higher incorporations of TiO2 nanoparticles. Morphological studies conducted by scanning electron microscopy and field emission scanning electron microscopy revealed that the microstructure of the Ni-TiO2 nanocomposite coatings are affected both by pulse potentials and durations, indicating that higher incorporations of TiO2 nanoparticles refine the microstructure. The results...