Sharif Digital Repository

A 3D continuum code coupled with a kinetic Monte Carlo module has been developed for the simulation of Ni electrocrystallization in the initial stages of nucleation and growth. Mass transfer in solution was controlled by a finite-difference code which is distributed over an irregular nanoscale grid system in vertical direction to the substrate. Deposition events such as surface diffusion, chemisorption and crystallization in the system were considered in a KMC module that processes the output of a diffusion-controlled scheme in probability functions to model electrodeposition process on surface. Electrochemical data of this simulation was simultaneously generated according to analytical... 

Controlled growth of atomic monolayers of IV-VII transition metal dichalcogenides (TMDs) has provided unprecedented opportunities to fabricate modern optoelectronic nanodevices. However, synthesis of large-area and high quality two-dimensional TMDs is still challenging. We have synthesized WS2 and MoS2 nanosheets by atmospheric pressure chemical vapor deposition (APCVD) at wide-range of processing conditions. The nanostructures were analyzed by optical and confocal microscopy, atomic force microscopy, Raman spectroscopy, and X-ray diffraction to determine the thickness, lateral size and structure of the deposits. Through designing and performing of a set of controlled experiments as well as... 

Electrochemical deposition of aluminum and manganese from basic and acidic molten AlCl3-NaCl-KCl mixture on an aluminum electrode at 180 °C was studied by the methods of voltammetry, and potential and current transient. The deposition of aluminum was found to proceed via a nucleation/growth mechanism in basic melt, while the deposition of manganese was found to be diffusion controlled in basic melt. The diffusion coefficient of Mn2+ ions in basic melt, as derived by voltammetry was in agreement with the deductions of transient methods. Analysis of the chronoamperograms indicates that the deposition of manganese on Al was controlled by 3D diffusion controlled nucleation and growth. The... 

Electrochemical deposition of aluminum and lead from basic molten AlCl3-NaCl-KCl mixture on an aluminum electrode at 180 °C was studied by the methods of voltammetry, potential and current transient and constant current deposition. The deposition of aluminum was found to proceed via a nucleation/growth mechanism, while the deposition of lead was found to be diffusion controlled. The diffusion coefficient calculated for Pb2+ ions in basic melt by voltammetry was in agreement with the deductions of transient method. The analysis of the chronoamperograms indicates that the deposition process of lead on Al substrates was controlled by 3D diffusion control, nucleation and growth. The processes... 

Nanocrystalline nickel titanate (NiTiO3) thin films and powders with mesoporous structure were produced at the low temperature of 500 °C by a straightforward particulate sol-gel route. The sols were prepared in various Ni:Ti molar ratios. X-ray diffraction and Fourier transform infrared spectroscopy revealed that the powders contained mixtures of the NiTiO 3 and NiO phases, as well as the anatase-TiO2 and the rutile-TiO2 depending on the annealing temperature and Ni:Ti molar ratio. Moreover, it was found that Ni:Ti molar ratio influences the preferable orientation growth of the nickel titanate, being on (202) planes for the nickel dominant powders (Ni:Ti ≥ 75:25) and on (104) planes for the... 

Gradual chemical (displacement) reaction between CuO and Al powders during high-energy attrition milling under a high purity argon atmosphere was studied. Differential thermal analysis (DTA), X-ray diffraction (XRD) and transmission electron microscopy (TEM) techniques were employed to study the solid-state reaction. It was shown that the solid-state reaction occurred during mechanical alloying (MA) and resulted in the dissolution of copper into the aluminum lattice and formation of nanometric alumina particles. The reinforcement particles were mostly distributed at the grain boundaries of Al matrix with an average crystallite size of about 50 nm. In DTA curve of the milled powders, a small...