Sharif Digital Repository

We proposed a modeling procedure to calculate the impact of temperature on the detection efficiency in photodetectors based on CdTe materials. Temperature increase impacts on the electrical properties of the materials such as carrier mobility and carrier recombination lifetime. This impact which can be effective in some cases has been normally ignored in the modeling approaches presented in the literature. Here we show that increasing the temperature from 190 K to 300 K not reduces the mobility of both electrons and holes but also significantly reduces the carrier lifetime. The result will impact on electric-field within the depletion width of the device, drift and diffusion lengths which... 

Pulsating heat pipes (PHPs) are compact cooling equipment used for various applications. This type of heat pipes can be used in renewable energy systems, cooling electronic devices, heat recovery systems and many other applications. Since PHPs have superior thermal performance, by applying them in energy systems enhance their efficiency. In addition, PHPs are a reliable medium for cooling various devices which have high heat flux. In this study, various works conducted on the applications of PHPs are reviewed and analyzed. It is concluded that PHPs are efficient and reliable devices for utilization in various energy systems. Moreover, at very low temperatures, such as cryogenic applications,... 

The capability to standardize the fracture strength of solder joints is an effective tool to investigate the reliability of electronic devices. To achieve this purpose, in this research, the influences of joint arrangement (loading arm and load sharing) on the level of constraint imposed on joint deformation, fracture energy, and generally, fracture behavior of solder joints were investigated. Fracture behavior of solder joints using double-cantilever-beam (DCB) specimens as a function of loading arm and load sharing (i.e., the distance between two solder joints) was studied under mode I loading conditions at a strain rate of 0.03 s−1. By increasing the loading arm, the fracture force, Fci,... 

Costly and time-consuming approaches for solder joint lifetime estimation in electronic systems along with the limited availability and incoherency of data challenge the reliability considerations to be among the primary design criteria of electronic devices. In this paper, an iterative machine learning framework is designed to predict the useful lifetime of the solder joint using a set of self-healing data that reinforces the machine learning predictive model with thermal loading specifications, material properties, and geometry of the solder joint. The self-healing dataset is iteratively injected through a correlation-driven neural network to fulfill the data diversity. Outcomes show a... 

Purpose: This paper aims to study the thermal and thermo-hydraulic performances of ferro-nanofluid flow in a three-dimensional trapezoidal microchannel heat sink (TMCHS) under uniform heat flux and magnetic fields. Design/methodology/approach: To investigate the effect of direction of Lorentz force the magnetic field has been applied: transversely in the x direction (Case I);transversely in the y direction (Case II); and parallel in the z direction (Case III). The three-dimensional governing equations with the associated boundary conditions for ferro-nanofluid flow and heat transfer have been solved by using an element-based finite volume method. The coupled algorithm has been used to solve... 

This paper proposes a model-based design approach for microgrids considering the aging of power electronic devices under different operating conditions. The proposed approach takes into account the physics of failure mechanisms in converter components as the failure prone devices in power systems. Furthermore, it considers the impacts of load profile on the aging of converter components and system performance. This approach facilitates accurate and optimized design of power electronic-based microgrids. According to this approach fragile links of power converters for a specified application can be identified. Moreover, the weakest converters based on their function in the microgrid can be... 

Inkjet printing of colloidal metals is an attractive method for direct patterning of electrically conductive structures and interconnects in electronic devices, owing to low-cost, low-waste and simplicity of the process. In the present work, mixtures of well-dispersed silver nanoparticles and ethylene glycol were prepared for the inkjet printing process. Three different surfactants including PVP, MSA and AOT were added to study the stability of the nanosilver colloids. The effect of high-intensity ultrasonic treatment and temperature on the rheological properties was investigated utilising a rheometer in plate-plate geometry. It is shown that the viscosity of the ink increases with... 

This paper reports transistor-level design of a new continuous-time (CT), discrete-time (DT) cascaded sigma delta modulator (SDM). The combination of a CT first stage and a DT second stage was utilized to realize a high speed, high resolution analog-to-digital converter (ADC). Power consumption of CT first stage is lowered by optimizing the gain coefficients of CT integrators in a feedforward topology. Moreover double sampling (CDS) was used in second stage integrators to further reduce power consumption. Proposed new SDM is simulated in 0.18μm CMOS technology and achieves 84dB dynamic range for a 10MHz signal bandwidth. Total analog power dissipation measured was 44mW