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Automatic Difficulty Estimation of Thematic Similarity MultipleChoice Questions
, M.Sc. Thesis Sharif University of Technology ; Sameti, Hossein (Supervisor) ; Bokaei, Mohammad Hadi (Supervisor)
Abstract
This project has been conducted in two related phases: In the first phase, we have attempted to write a program capable of answering thematic similarity multiple-choice questions without utilizing any training data. The best performance in this phase was attained by the 25-topic LDA model using the Hellinger distance between the probability distributions of the poetic verses. This model managed to attain an accuracy of 42%, which is very close to the average human performance of 43%. In the second phase, two tasks of seven-class classification and binary classification were defined based on the p-value of the questions. To this end, the questions were initially ranked according to the...
Predicting crack initiation of solder joints with varying sizes under bending
, Article Journal of Electronic Materials ; 2019 ; 03615235 (ISSN) ; Farrahi, G. H ; Nourani, A ; Soroosh, F ; Sharif University of Technology
Springer New York LLC
2019
Abstract
The critical strain energy release rate for crack initiation, J ci , was measured under mode I loading for SAC305 solder joints between two copper substrates. Fracture tests were performed using double cantilever beam specimens at a strain rate of 0.03 s −1 . Different bond-line widths (i.e., joint size in the out-of-plane dimension) and thicknesses, were examined. The fracture force per unit width and J ci (the average value of four J-integral contours encircling the crack tip) were relatively insensitive to the width of the joint ranging from 8 mm to 21 mm. Variations in bond-line thickness (i.e., 150 μm, 250 μm and 450 μm) also had an insignificant influence on the fracture energy of...
Predicting crack initiation of solder joints with varying sizes under bending
, Article Journal of Electronic Materials ; 2019 ; 03615235 (ISSN) ; Farrahi, G. H ; Nourani, A ; Soroosh, F ; Sharif University of Technology
Springer New York LLC
2019
Abstract
The critical strain energy release rate for crack initiation, J ci , was measured under mode I loading for SAC305 solder joints between two copper substrates. Fracture tests were performed using double cantilever beam specimens at a strain rate of 0.03 s −1 . Different bond-line widths (i.e., joint size in the out-of-plane dimension) and thicknesses, were examined. The fracture force per unit width and J ci (the average value of four J-integral contours encircling the crack tip) were relatively insensitive to the width of the joint ranging from 8 mm to 21 mm. Variations in bond-line thickness (i.e., 150 μm, 250 μm and 450 μm) also had an insignificant influence on the fracture energy of...