Sharif Digital Repository

Coping with the intrinsic limitations of electrical networks-on-chip, optical on-chip interconnect is emerged as a promising paradigm for future high performance multi-core designs. However, optical networks-on-chip (ONoCs) are drastically vulnerable to on-chip thermal fluctuation. Specifically, electrical power consumed by processing cores induces temperature drift, which may cause false paths for optical data communication through the network. Therefore, customizing electrical power distribution throughout the chip plays a critical role for reliable data communication in ONoCs. On the other hand, chip-scale distribution of electrical power is directly affected by mapping various... 

Integrated silicon photonic networks have attracted a lot of attention in the recent decades due to their potentials for low-power and high-bandwidth communications. However, these promising networks, as the future technology, are drastically susceptible to thermal fluctuations, which may paralyze wavelength-based operation of these networks. In this regard, precise addressing of thermally induced faults in optical networks-on-chip (ONoCs), as well as revealing practical methods to tackle this challenge will be a break-even point toward implementation of this technology. In this paper, thermal variation is investigated through analyzing on-chip power distribution, which is addressed by power... 

Optical networks-on-chip are introduced as an alternative for electrical interconnects in many-core systems, due to their low delay and power consumptions, as well as their high bandwidths. Despite these advantages, physical characteristics of the photonic components are highly sensitive to thermal variations, which results in optical data misrouting through the optical networks at the presence of temperature fluctuation. In this paper, we propose a thermally-resilient all-optical communication approach which improves reliability, as well as performance of the optical networks. For this purpose, we take advantages of auxiliary waveguides and a novel wavelength assignment approach to avoid... 

With the growing number of cores, high-performance systems face power challenges due to dominating communication power. Thus, attaining energy efficient high-bandwidth inter-core communication nominates photonic network-on chip as the most promising interconnection paradigm. Although photonic networks pave the way for extremely higher performance communications, their intrinsic susceptibility to thermal fluctuations intimidates reliability of system. This necessitates the development of methodologies to analyze and model thermal effects on network behavior. In this paper, we model temperature fluctuations of optical chips and analyze photonic networks in a holistic approach. We present a... 

There have been significant advances in fabrication of high-density microelectrode arrays using silicon micromachining technology in neural signal recording systems. The interface between microelectrodes and chemical environment brings great interest to researchers working on extracellular stimulation. This interface is quite complex and must be modeled carefully to match experimental results. Computer simulation is a method to increase the knowledge about these arrays and to this end the finite element method provides a strong environment for investigation of relative changes of the electrical field extension surrounding an electrode positioned in chemical environment. In this paper FEM...