Sharif Digital Repository

Thin films of materials, in order to have magnificent structure and properties, can use in complicated technology such as; electronic, optic and magnetic systems. Printed interconnects can be made by the deposition of suspensions of metal nanoparticles (e.g., silver and gold) followed by thermal sintering. The nanoparticle sintering process involves atomic diffusion resulting in shrinkage. As a result, the interconnects are prone to residual stresses generated during the thermal sintering process. The residual stress can cause cracks and delamination in the thin films and can cause permanent geometrical changes in the underlying substrates which may affect the functionality of the...