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Thermal Fatigue Investigation of Different Geometrical Aspect of via in Integrated Circuits
, M.Sc. Thesis Sharif University of Technology ; Adib Nazari, Saeid (Supervisor)
Abstract
The reliability of integrated circuits (IC) is related to material imperfections such as holes, cavities, cracks and etc. which occur in the manufacturing process. The operational conditions of IC create thermal stresses. These thermal stresses increase the chance of failure by making the imperfections critical in IC’s components such as VIA that is used as connection between interconnects in the multilevel integrated circuits. As a result, thermal fatigue needs to be investigated in VIA thoroughly.
The thermal stresses in VIA increase the possibility of hole forming due to hydrostatic stresses during manufacturing process and the amplitude of applied stresses under the operational...
The thermal stresses in VIA increase the possibility of hole forming due to hydrostatic stresses during manufacturing process and the amplitude of applied stresses under the operational...