Sharif Digital Repository

Nowadays, the use of redundancy components on chips is the best method for replacing defective components on chip. This method improves yield parameter and thus reduces the manufacturing cost of a chip. However, in most of yield improvement methods, redundancy is used when the main components of a chip are defective, which is called cold redundancy. In this project, the manufacturing cost and yield parameters of chips, when using hot redundancy in SIMT processors is investigated. In the case of occurring defect on the chip, the hot redundant components are used for improving yield. Otherwise, they are used in order to improve the performance of chip. In this project, we examine systems,... 

In distress periods, liquidity constrained investors sell liquid corporate bonds and hold onto illiquid ones, a phenomenon which we refer to as flight from liquidity. Performing within issuer-time analysis to properly control for (changes in) credit risk, we find that flight from liquidity results in a decline in the liquidity premium and in a temporary underperformance of liquid corporate bonds during distress periods. Our findings suggest that holding credit risk fixed, liquid bonds do not provide safety during the time it is most needed.