Loading...

Cu surface segregation in Ni/Cu system

Rasuli, R. (Reza.) ; Sharif University of Technology

852 Viewed
  1. Type of Document: Article
  2. DOI: 10.1016/j.vacuum.2009.10.009
  3. Abstract:
  4. We report experimental evidence of Cu surface segregation in Ni/Cu system, during deposition of Ni film onto Cu substrate at room temperature and during heat treatment in vacuum. Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS) by Tougaard's analysis results show that surface segregation defeats in competition with increase in Ni thickness and terminates when thickness of Ni increase to more than 4 nm. Surface energy and concentration were calculated using contact angle measurements and the results confirm that segregation reduces the surface energy. Surface segregation during heat treatment at 150–220 °C range as a function of time initially shows linear mass transfer. By solving Fick's equation and taking empirical diffusion coefficient, 125 ± 20 kJ/mol is obtained for activation enthalpy of effective diffusion
  5. Keywords:
  6. Surface segregation ; Diffusion ; Nickel ; Copper ; Auger electron spectroscopy ; X-ray photoelectron spectroscopy
  7. Source: Vacuum ; Volume 84, Issue 4 , 8 December , 2009 , PP. 469-473
  8. URL: http://www.sciencedirect.com/science/article/pii/S0042207X09004680