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Simulation of PMMA Substrates Deep Plasma Etching

Azimi, Sajjad | 2015

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  1. Type of Document: M.Sc. Thesis
  2. Language: Farsi
  3. Document No: 46990 (08)
  4. University: Sharif University of Technology
  5. Department: Mechanical Engineering
  6. Advisor(s): Saeedi, Mohammad Saeed; Kazemzadeh Hannani, Siamak
  7. Abstract:
  8. One of the most important applications of plasma is etching of substrates. This process is the key element of microfabrication. In order to improve the microstructures quality, it is necessary to improve plasma etching process. Therefore different methods have been developed to make etching process more efficient. The latest method is Bosch-process etching method. In this project to understand the effect of input parameters, Bosch-process etching of a PMMA substrate is simulated. Based on the governing equations, the problem is divided to four parts. First, by developing a heuristic approach to solve Maxwell’s equations numerically, electric and magnetic fields in the chamber are determined. Second, by using the Particle-in-Cell method for simulation of plasma, the location and velocity of electrons are specified. Third, by using of the electrons’ location and energy, the location and velocity of ions are obtained. Finally the effect of plasma on the surface is investigated and the results are analyzed. Based on the results, it is concluded that increasing the chamber pressure and the input power would result in enhancement of chemical species generation and transferred momentum to the surface. The results of this project will be used for construction of a Bosch-process plasma etching apparatus
  9. Keywords:
  10. Plasma ; Maxwell Equations ; Particles in Cell Technique ; Etching ; Bosch-Process Etching Method ; Yee's Method

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