Loading...

Effect of Constraint on Fracture Energy and Fracture Load Prediction of Solder Joints

Mirmehdi, Sadegh | 2017

609 Viewed
  1. Type of Document: M.Sc. Thesis
  2. Language: Farsi
  3. Document No: 50314 (08)
  4. University: Sharif University of Technology
  5. Department: Mechanical Engineering
  6. Advisor(s): Farrahi, Gholamhossein
  7. Abstract:
  8. Mode І critical strain energy release rate at crack initiation, Jci, of SAC305 solder joints between two copper substrates was measured using double cantilever beam (DCB) specimens at a strain rate of 0.03 s-1 as a function of bond-line width (i.e. joint size in the out-of-plane dimension), solder thickness, copper adherends thickness and suface roughness. Fracture force per unit width and Jci were relatively insensitive to width of the joint ranging from 8 to 21 mm. Variations in solder thickness (i.e. 150 µm, 250 µm and 450 µm) also had an insignificant influence on the fracture energy of solder joints. This behavior was explained in terms of stress distribution, plastic zone area and triaxiality factor produced in the solder layer. It was shown that an increase in adherend thickness from 8 mm to 21 mm increased fracture force almost linearly, while Jci decreased about 60%. Surface roughness has no significant influence on fracture force and Jci. Comparison of fracture behavior in SAC305 (lead-free) and Sn-37Pb (leaded) solder alloys showed that the difference between the average Jci values obtained from those was not statistically significant. A decrease in loading arm from 71 mm to 48 mm caused the fracture force to increase by about 41%, while Jci remained almost unchanged
  9. Keywords:
  10. Surface Roughness ; Fracture Energy ; Constraints ; Soldering ; Joint Width ; Joint Thickness ; Adherend Thickness

 Digital Object List

 Bookmark

No TOC