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Low-overhead thermally resilient optical network-on-chip architecture

Tinati, M ; Sharif University of Technology | 2019

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  1. Type of Document: Article
  2. DOI: 10.1016/j.nancom.2019.03.001
  3. Publisher: Elsevier B.V , 2019
  4. Abstract:
  5. Integrated silicon photonic networks have attracted a lot of attention in the recent decades due to their potentials for low-power and high-bandwidth communications. However, these promising networks, as the future technology, are drastically susceptible to thermal fluctuations, which may paralyze wavelength-based operation of these networks. In this regard, precise addressing of thermally induced faults in optical networks-on-chip (ONoCs), as well as revealing practical methods to tackle this challenge will be a break-even point toward implementation of this technology. In this paper, thermal variation is investigated through analyzing on-chip power distribution, which is addressed by power profile of SPEC 2006 benchmark applications. Based on these assessments, herein we propose a low-power thermal-resilient optical network-on-chip (The-RONoC) architecture that significantly mitigates routing faults in ONoC. Utilizing a corrective unit in this architecture, 50% of the thermally induced switching faults are recovered with the cost of less than 2% area overhead. In addition, up to 42% performance improvement is achieved through this architecture in comparison to the basic architecture. Finally, we explore scalability of The-RONoC based on formal SNR analysis, as well as power consumption and the probability of optical transmission speed-up. © 2019
  6. Keywords:
  7. Formal SNR analysis ; Network-level fault evaluation ; Optical NoC ; Power consumption ; Temperature variation ; Thermally resilient ONoC ; Benchmarking ; Computer architecture ; Electric power utilization ; Fiber optic networks ; Light transmission ; Low power electronics ; Network architecture ; Servers ; Signal to noise ratio ; Silicon photonics ; Benchmark applications ; Fault evaluation ; High bandwidth communication ; On-chip power distribution ; Optical networks on chips ; Network-on-chip
  8. Source: Nano Communication Networks ; Volume 20 , 2019 , Pages 31-47 ; 18787789 (ISSN)
  9. URL: https://www.sciencedirect.com/science/article/abs/pii/S1878778918301339