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Microstructural evolution in the transient-liquid-phase bonding area of IN-738LC/BNi-3/IN-738LC

Mosallaee, M ; Sharif University of Technology | 2008

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  1. Type of Document: Article
  2. DOI: 10.1007/s11661-008-9588-0
  3. Publisher: 2008
  4. Abstract:
  5. Transient-liquid-phase (TLP) bonding of the IN-738LC base alloy with BNi-3 interlayer was investigated in this article. Effects of the TLP bonding thermal cycle on the base alloy were studied microstructurally and macrostructurally. Microscopic investigation revealed that the microstructural evolution in the TLP bonding area was affected substantially by the bonding temperature. Therefore, a critical bonding temperature (Tcr) was defined for TLP bonding of IN-738LC/ BNi-3/IN-738LC samples. Unlike bonding below Tcr, TLP bonding at temperatures higher than Tcr resulted in formation of individual γ-γ' colonies in the adjacent base alloy to TLP bonding zone and caused significant reduction in the isothermal solidification kinetic. During TLP bonding at temperatures less than Tcr, B-rich precipitates with two different morphologies, blocky and acicular, were formed in the adjacent base alloy to the TLP bonding zone. Microhardness and three-point bending tests were carried out in order to determine the effect of these formed constituents in the TLP bonding area on the mechanical properties of bonded samples. © The Minerals, Metals & Materials Society and ASM International 2008
  6. Keywords:
  7. Alloys ; Microstructural evolution ; Bonding temperatures ; Liquid-phase ; Micro-structural ; TLP bonding ; Liquid phase epitaxy
  8. Source: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science ; Volume 39, Issue 10 , 2008 , Pages 2389-2402 ; 10735623 (ISSN)
  9. URL: https://link.springer.com/article/10.1007/s11661-008-9588-0