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Study on Electromigration Phenomenon and Lifetime Estimation of Integrated Circuits

Salehi, Mohammad | 2021

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  1. Type of Document: M.Sc. Thesis
  2. Language: Farsi
  3. Document No: 54527 (05)
  4. University: Sharif University of Technology
  5. Department: Electrical Engineering
  6. Advisor(s): Medi, Ali
  7. Abstract:
  8. Estimating the life-time of electronic devices has always been an important issue in their mass production. Nowadays, electronic chips are widely used due to technological advances and due to their smaller size. They may be more likely to break down because of their complexity. Therefore, estimating their life-time has received much attention. In the first chapters of this thesis, the concepts and standards that exist in the field of reliability and the life expectancy of electronic devices are discussed. There are many reasons for chip failure, which are beyond the scope of this thesis but what is known as the most important cause of failure which is named electromigration has been discussed in detail. This failure factor weakens and damages the metal interconnects in the chips. In the following chapters, a circuit and software that can be used for chip life tests are suggested. And then using the same system, several chips having metal connections in them were tested (at different temperatures, different current densities, and different dimensions of the metals) and their failure time due to electromigration was measured, and using the statistical and probabilistic relations governing the subject, the relations related to electromigration was formulated. It is possible to use the results for other systems
  9. Keywords:
  10. Electromigration ; Reliability ; Life Time ; Failure Probability ; Automatic Test Equipment (ATE) ; Life Time Estmation

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