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Effect of environmental conditions on fracture behavior of solder joints

Honarvar, S ; Sharif University of Technology | 2021

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  1. Type of Document: Article
  2. DOI: 10.1016/j.tafmec.2021.102897
  3. Publisher: Elsevier B.V , 2021
  4. Abstract:
  5. Double cantilever beam (DCB) specimens were prepared according to standard surface mount technology (SMT). The samples were stored inside an environmental chamber at two different relative humidity values (i.e. 40 or 100%) for either 2 or 4 h. Then they were aged at 25 °C, 75 °C or 125℃ for the same time. Finally, after being cooled to room temperature, fracture tests were performed under mode-I loading conditions at a strain rate of 0.03 s−1 at room temperature. Storage time did not have a significant effect on the fracture behavior. The fracture load and energy of the solder joints decreased significantly when the temperature was increased from 25 to 75℃. By further increase in the temperature from 75 to 125℃, the fracture strength slightly increased. This behavior was attributed to the thickness of intermetallic compound (IMC) as well as the portion of brittle phases on the joint microstructure. The influence of relative humidity on the fracture strength was less than the temperature effect due to coarsening behavior of microstructure with a humidity rise. The fracture surface of the specimen stored at a temperature of 25℃ and relative humidity of 40% was flat and smooth, while in other cases, the fracture surfaces showed a three-dimensional roughness. © 2021 Elsevier Ltd
  6. Keywords:
  7. Cantilever beams ; Coarsening ; Environmental chambers ; Fracture mechanics ; Fracture testing ; Fracture toughness ; Soldered joints ; Strain rate ; Coarsening behavior ; Double cantilever beam ; Environmental conditions ; Fracture behavior ; Fracture load ; Fracture surfaces ; Joint microstructures ; Mode I loadings ; Surface mount technology
  8. Source: Theoretical and Applied Fracture Mechanics ; Volume 112 , 2021 ; 01678442 (ISSN)
  9. URL: https://www.sciencedirect.com/science/article/pii/S0167844221000057?via%3Dihub