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Simulation of Heat Pyrolysis Process of Polymer Components of Printed Circuit Boards

Paidar Arani, Monsour | 2022

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  1. Type of Document: M.Sc. Thesis
  2. Language: Farsi
  3. Document No: 55161 (06)
  4. University: Sharif University of Technolog
  5. Department: Chemical and Petroleum Engineering
  6. Advisor(s): Farhadi, Fathoola; Fatovat, Farzam
  7. Abstract:
  8. The purpose of this study is the simulation of Printed Circuit Board’s thermal decomposition process based on the latest updated environmentally safe methods, to produce valuable materials. The method used is an efficient process for recycling printed circuits to prevent harmful environmental consequences of inadequate methods, and also to obtain a small amount of fuel for recycling. In this research, the pyrolysis process of printed circuits has been simulated using Aspen Plus software. In the simulation, a fluidized bed is used as a pyrolysis reactor and also a combination of two mechanisms is used to determine the kinetics and reactions in the reactor. The desired product in this process is the liquid phase, which can be used as fuel because of its unsaturated compounds such as aromatics content; The maximum liquid product was obtained at a temperature of 500 oC and amounted to about 67.6 wt% of initial PCB feed. The amount of aromatics and bromine compounds in the liquid phase at this temperature is about 1.3% and 3.8% by weight, respectively. Due to the low aromatic content of the liquid phase, the operating temperature can be increased, which in turn reduces the amount of produced liquid and its bromine components.
  9. Keywords:
  10. Printed Circuit Board ; Pyrolysis ; Process Simulation ; Cracking Rotation ; Fluidized Bed Reactor ; Aromatic Compounds

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