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Geometry influence on fracture behavior of lap-shear solder joints

Karimi, M ; Sharif University of Technology | 2022

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  1. Type of Document: Article
  2. DOI: 10.1109/TCPMT.2021.3132197
  3. Publisher: Institute of Electrical and Electronics Engineers Inc , 2022
  4. Abstract:
  5. Single lap-shear (SLS) specimens of 63Sn37Pb solder joints were prepared with three different adherend thicknesses at three varying joint lengths. The fracture force was measured at a shear strain rate of 0.01 s-1 for different geometries. The elastic-plastic fracture mechanics (EPFM) theory was used to find the energy dissipated in each case using a finite element model (FEM), and the fracture energy was obtained by cohesive zone modeling (CZM). Both 2-D and 3-D models were used to explain the variations in fracture energy by the level of constraint on the joint. Also, the plastic zone area and stress distribution along the solder layer were calculated at the moment of fracture. A phase angle definition was proposed and compared in different solder lengths to show its influence on fracture energy. It was concluded that the fracture energy was influenced by the local phase angle and plastic zone area at the moment of fracture. The effect of adherend thickness on fracture load was significant especially for long joints (i.e., lengths of 6.35 and 12.7 mm). The observations on the crack path showed that the crack was initiated near one of the adherends and tended to propagate within the intermetallic compound (IMC) layer. Also, the planar fracture surface was observed in all the specimens except for the short solder joints (i.e., with the length of 2.54 mm). © 2011-2012 IEEE
  6. Keywords:
  7. Fracture ; Lap-shear ; Plastic deformation ; Stress distribution ; Binary alloys ; Copper ; Cracks ; Elasticity ; Elastoplasticity ; Fracture mechanics ; Lead alloys ; Shear strain ; Soldering ; Strain energy ; Strain rate ; Stress concentration ; Stress-strain curves ; Tin alloys ; Adherend thickness ; Finite element analyse ; Fracture behavior ; Fracture path ; Geometry influences ; Lap shear ; Phase angles ; Plastic zones ; Solder joints ; Stresses distribution ; Finite element method
  8. Source: IEEE Transactions on Components, Packaging and Manufacturing Technology ; Volume 12, Issue 1 , 2022 , Pages 80-88 ; 21563950 (ISSN)
  9. URL: https://ieeexplore.ieee.org/document/9632615