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Recent advances in processing, and mechanical, thermal and electrical properties of Cu-SiC metal matrix composites prepared by powder metallurgy

Akbarpour, M. R ; Sharif University of Technology | 2023

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  1. Type of Document: Article
  2. DOI: 10.1016/j.pmatsci.2023.101191
  3. Publisher: Elsevier Ltd , 2023
  4. Abstract:
  5. The demand for advanced materials such as silicon carbide particles reinforced copper matrix composites (Cu-SiC) is increasing due to the stringent design requirement in the electronic packaging, mechanical relays, welding electrodes, electrical contacts, contactors, switches, and circuit breaks industries. High interest in Cu-SiC composites is highlighted by combining high thermal and electrical conductivity with mechanical strength, mouldability, and low production cost. Two decades of intensive research have provided a wealth of new scientific knowledge on the intrinsic and extrinsic effects of SiC reinforcement vis-à-vis mechanical, tribological, thermal, and electrical properties of copper. This paper is intended to provide a comprehensive and critical review of the state-of-the-art scientific research related to processing, effective parameters, and strategies to modify the Cu-SiC interface in these composites and covers comprehensive aspects related to the microstructural, mechanical, tribological, thermal, and electrical properties of Cu-SiC composites. © 2023 Elsevier Ltd
  6. Keywords:
  7. Copper ; Mechanical properties ; Metal matrix composites ; Powder metallurgy ; SiC ; Thermal conductivity
  8. Source: Progress in Materials Science ; Volume 140 , 2023 ; 00796425 (ISSN)
  9. URL: https://www.sciencedirect.com/science/article/pii/S0079642523001238