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Design and Development of Material-In-Material Additive Manufacturing Process for Electronic Devices

Mousavi, Morteza | 2021

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  1. Type of Document: M.Sc. Thesis
  2. Language: Farsi
  3. Document No: 58082 (08)
  4. University: Sharif University of Technology
  5. Department: Mechanical Engineering
  6. Advisor(s): Movahhedy, Mohammad Reza
  7. Abstract:
  8. Freely design and volume and fabrication cost reduction of electronic devices with three-dimensional structures are some of the improvements resulted from combining additive manufacturing with conductive inks that revolutionized the fabrication of practical electronic devices such as cell phones, computers, and satellites impressively. Although numerous processes of additive manufacturing have been proposed and implemented to fabricate electronic devices so far, the majority of these approaches have not only low speed and high components’ fabrication costs but also have many constraints in consumed materials. Therefore, the design and development of a novel additive manufacturing method to overcome and decrease these limitations is the main objective of this research. The "material in material" process is the proposed name for this new additive manufacturing method designed and developed based on the injection of various substances, including conductive ones, into another material (the environmental material). In this process, the environmental material is placed in an open frame in the form of the final component, and conductive ink is injected into the polymeric environmental material using a nozzle. After curing, a monolithic structure is generated, including conductive paths and the body. At the beginning of this project, the components, performance, obligations, advantages, and constraints of the material in material additive manufacturing process are introduced. The following section tests and compares various consumable materials based on their density ratios and rheologic behaviors to analyze the components' printing performance. In this section, the effects of fabrication parameters on the conductivity and cross-sections of printing paths are evaluated after selecting appropriate consuming materials. In what follows, the process's cost-effectiveness is analyzed compared to the other additive manufacturing processes, and finally, printing a practical component is considered. The results revealed a suitable and cost-effective performance of the process of material in material additive manufacturing in printing electronic and non-electronic devices. Although selecting proper consumable materials is confronted by some challenges in this research, an optimum printing condition is provided to produce embedded conductive paths for selected materials. The achieved optimal printing conditions for the range of the under-measurement fabrication parameters are 19 gauge needle, the movement speed of 0.5 millimeters per second for nozzle, and filament diameter to nozzle diameter ratio of 7.5
  9. Keywords:
  10. Additive Manufacturing ; Three Dimentional Printing ; Material-In-Material Process ; Conductive Ink ; Electronics Devices

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