Sharif Digital Repository

Due to the physical limitations of the conventional 2D ICs at Giga-Scale Integration, modern technologies have been emerged. Among them, through silicon via (TSV) - based 3D ICs have been used to continue Moore’s law in the interconnect era. In these systems, dies are stacked at z-direction after wafer thinning. Electrical connections between stacked dies are done by TSVs. One important advantage of 3D integration technology is their ability to stack heterogeneous systems with different technologies on a single chip. This will not only increase interconnect density but also will reduce the delay and power consumption. However, nowadays, fabrication and optimum design of TSVs are still big... 

In the present study, a high-order accurate numerical solution of steady incompressible slip flow and heat transfer in 2D microchannels is presented. The numerical method used is an alternating direction implicit operator scheme which is efficiently implemented to solve the incompressible Navier-Stokes equations in the primitive variables formulation using the artificial compressibility method. To stabilize the numerical solution, numerical filters are used. The present methodology considers the solution of the Navier-Stokes equations with¬ employing different slip boundary condition¬¬ (Maxwell,¬ ¬¬Hyperbolic tangent function of Knudsen number¬ and Beskok slip models)¬ ¬¬on the wall to model...