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Power delivery solutions in 3-D processor-DRAM systems in presence of hot spots

Zabihi, M ; Sharif University of Technology | 2014

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  1. Type of Document: Article
  2. DOI: 10.1109/EPEPS.2014.7103635
  3. Publisher: Institute of Electrical and Electronics Engineers Inc , 2014
  4. Abstract:
  5. An important application of 3-D integration technology is stacked processor-DRAM systems. One of the major design issues in 3-D processor-DRAM stacks is power delivery. Presence of hot spots, high density power regions, in processor die poses serious challenges to the design of power distribution network (PDN). In this paper, we investigate solutions to ensure power integrity in the hot spot regions
  6. Keywords:
  7. 3-D processor-DRAM integrated system ; power distribution network (PDN) ; Electric network analysis ; Electric power distribution ; Electric power systems ; Electric power transmission ; Electronics packaging ; 3-D integration ; Density power ; Hot spot ; Integrated systems ; Power delivery ; Power distribution network ; Power integrity ; Power-supply noise ; Integrated circuit design
  8. Source: 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014, 26 October 2014 through 29 October 2014 ; Oct , 2014 , Pages 207-210 ; 9781479936410 (ISBN)
  9. URL: http://ieeexplore.ieee.org/document/7103635/?arnumber=7103635