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Stress gradient interpretation of boundary layers in passivated thin films

Zamani, Z ; Sharif University of Technology | 2016

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  1. Type of Document: Article
  2. DOI: 10.1016/j.ijnonlinmec.2016.01.009
  3. Publisher: Elsevier Ltd , 2016
  4. Abstract:
  5. A continuum implementation of stress gradient plasticity is established to analyze passivated thin films under tension. It is verified and evaluated by investigation of the tensile response of passivated Cu films with different thicknesses and grain sizes. The material parameters are fitted to the stress-strain experimental data, while the length scale parameter is directly characterized from the corresponding available discrete dislocation predictions. The numerical solutions give rise to boundary layers near the interface between film and passivation. This prediction is consistent with the formation of dislocation pileups at the film-passivation interface and also is responsible for the thickness-dependent hardening observed in passivated thin films. The numerical results are in good agreement with the experimental data and discrete dislocation predictions. © 2016 Elsevier Ltd
  6. Keywords:
  7. Hardening rate ; Passivated thin films ; Size effects ; Stress gradient plasticity ; Boundary layers ; Copper ; Forecasting ; Hardening ; Interfaces (materials) ; Passivation ; Plasticity ; Discrete dislocations ; Dislocation pileup ; Length scale parameter ; Material parameter ; Numerical results ; Numerical solution ; Stress gradient ; Thin films
  8. Source: International Journal of Non-Linear Mechanics ; Volume 81 , 2016 , Pages 139-146 ; 00207462 (ISSN)
  9. URL: http://www.sciencedirect.com/science/article/pii/S002074621600010X